Enzo Tech Low Profile Copper BGA Progressive Cooling Heatsinks (8 Pcs) - BCC9-LE

Description

BCC9-LE is a low profile version of the BMR-C1 that has a refined fin height and base thickness. Will work with specific applications that has low clearance.
ATI® & NVIDIA®
Compatible
Pure forged copper
Easy installation
by using 3M™ 8815 Thermal Tape
Multipack
- Eight (8) piece set
Low profile
Dimensions (mm)
14(L) mm x 14mm(W) x 9mm(H)
Material
C1100 Forged Copper
Finish
Matt Black
Weight
5g (Each)
Thermal Adhesive
3M™ 8815 Thermal Tape
International Shipping
USPS first class international mail does not come with a tracking number, which means it can not be tracked.
So please do not ask us for your package's transit status.
We just do not have such information for first class mail delivery.
It comes with a delivery confirmation number which can be updated upon delivery, however sometimes the package gets delivered without being updated.
USPS First class mail delivery takes longer than other methods of delivery and does not have guaranteed delivery date. Do not expect the delivery takes within 7~10 business days. *** Sometimes even longer.
So if you need your order in certain time frame or your order is high value item, we suggest to use Priority or Express mail.
Full amount (including shipping charge) will be declared in custom form for the insurance purpose.
Customer is responsible for paying all the import taxes.
Returns
Defective return: Customer is responsible for paying of shipping defective item(s).  This is same for international customers.
Non-defective item return : Used product is not refundable. If it is non defective return, the retail package must not be opened and item must not be used.
There will be charge of 15% restocking fee and the original shipping fee is not refundable.