-40%
Enzotech BCC9-LE Low Profile Copper BGA Heatsinks (8 Pcs)
$ 14.77
- Description
- Size Guide
Description
BCC9-LE is a low profile version of the BMR-C1 that has a refined fin height and base thickness. Will work with specific applications that has low clearance.ATI® & NVIDIA® Compatible
Pure forged copper
Easy installation by using 3M™ 8815 Thermal Tape
Multipack - Eight (8) piece set
Low profile
Dimensions (mm) 14(L) mm x 14mm(W) x 9mm(H)
Material C1100 Forged Copper
Finish Matt Black
Weight 5g (Each)
Thermal Adhesive 3M™ 8815 Thermal Tape